| 摘要 |
PROBLEM TO BE SOLVED: To provide a tentatively fixing film which has low-temperature adhesion enough to adequately fix a semiconductor wafer to a support member even when lamination is performed at a low temperature, and has a sufficient heat resistance, and by which a semiconductor wafer after processing can be separated from the support member easily, and to provide a tentatively fixing film sheet, and a manufacturing method of a semiconductor device by use of the tentatively fixing film.SOLUTION: A manufacturing method of a semiconductor device comprises the steps of: tentatively fixing a semiconductor wafer 70 to a support member 60 with a tentatively fixing film 20 interposed between the semiconductor wafer and the support member, provided that the tentatively fixing film includes a polyimide resin produced by the reaction between diamine and acid dianhydride including 20 mol% or more of tetracarboxylic dianhydride to the total amount of acid dianhydride; performing a predetermined processing on the semiconductor wafer remaining tentatively fixed to the support member; separating the processed semiconductor wafer from the support member by bringing an organic solvent into contact with the tentatively fixing film to dissolve part or all of the tentatively fixing film into the organic solvent; and splitting the processed semiconductor wafer into individual pieces. |
