| 发明名称 |
LEAD-FREE SOLDER COMPOSITION FOR GLASS |
| 摘要 |
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component. |
| 申请公布号 |
US2014044589(A1) |
申请公布日期 |
2014.02.13 |
| 申请号 |
US201213712326 |
申请日期 |
2012.12.12 |
| 申请人 |
HYUNDAI MOTOR COMPANY;KIA MOTORS CORPORATION;KOREA AUTOGLASS CORPORATION;HEESUNG MATERIAL LTD. |
发明人 |
JEONG HAE WON;PARK HYUN DAL;LEE TAE SEUNG;KIM SEUNG KYU;JOO HONG NHO;YOON HO JUNE;BAK MIN HO;LEE JOO DONG;JUNG HYUN CHAE;LEE SUN MYUNG |
| 分类号 |
B23K35/24 |
主分类号 |
B23K35/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
