发明名称 RESIST PATTERN FORMATION METHOD AND RESIST COMPOSITION FOR NEGATIVE-WORKING IMAGE DEVELOPMENT
摘要 <p>A method of forming a resist pattern including: forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent by action of an acid; exposing the resist film; and patterning by a negative-tone development using a developing solution containing the organic solvent, wherein the base component (A) contains a resin component (A1) having a structural unit (a0) which generates acid upon exposure and a structural unit (a1) derived from an acrylate ester which may have the hydrogen atom bonded to the carbon atom on the alpha-position substituted with a substituent and contains an acid decomposable group which exhibits increased polarity by the action of acid, and the developing solution contains a nitrile solvent.</p>
申请公布号 KR20140018269(A) 申请公布日期 2014.02.12
申请号 KR20137025472 申请日期 2012.03.07
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 HIRANO TOMOYUKI;TAKAKI DAICHI;SHIONO DAIJU;KONNO KENRI;TAKAGI ISAMU
分类号 G03F7/039;C08F220/28;C08F220/38;G03F7/038;G03F7/30;H01L21/027 主分类号 G03F7/039
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