发明名称 |
METHOD FOR PERMANENTLY BONDING WAFERS |
摘要 |
This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate. |
申请公布号 |
EP2695183(A1) |
申请公布日期 |
2014.02.12 |
申请号 |
EP20110714257 |
申请日期 |
2011.04.08 |
申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
PLACH, THOMAS;HINGERL, KURT;WIMPLINGER, MARKUS;FLOETGEN, CHRISTOPH |
分类号 |
H01L21/20;H01L21/762 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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