| 发明名称 |
Low noise flip-chip packages and flip chips thereof |
| 摘要 |
A flip chip comprises first and second circuitry portions formed in a substrate. The first and second circuitry portions are spaced apart from one another in a separation direction. A substrate-contact boundary is formed in the substrate between the first and second circuitry portions. |
| 申请公布号 |
US8648475(B2) |
申请公布日期 |
2014.02.11 |
| 申请号 |
US201213434473 |
申请日期 |
2012.03.29 |
| 申请人 |
DEDIC IAN JUSO;ALI GHAZANFER;FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
DEDIC IAN JUSO;ALI GHAZANFER |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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