发明名称 |
SUBSTRATE PROCESSING DEVICE |
摘要 |
According to an embodiment of the present invention, a substrate processing device may include a chamber with an internal cavity; a body which is placed on the cavity, on which a substrate is installed, and which is shaped to face the substrate; a vacuum part inside the body to make the substrate absorbed to the top of the body; and a heating part inside the body to heat the substrate. |
申请公布号 |
KR20140016046(A) |
申请公布日期 |
2014.02.07 |
申请号 |
KR20120083093 |
申请日期 |
2012.07.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI, JIN WON;YOU, YON HO |
分类号 |
H01L21/50;H01L21/02;H01L21/48 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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