发明名称 SUBSTRATE PROCESSING DEVICE
摘要 According to an embodiment of the present invention, a substrate processing device may include a chamber with an internal cavity; a body which is placed on the cavity, on which a substrate is installed, and which is shaped to face the substrate; a vacuum part inside the body to make the substrate absorbed to the top of the body; and a heating part inside the body to heat the substrate.
申请公布号 KR20140016046(A) 申请公布日期 2014.02.07
申请号 KR20120083093 申请日期 2012.07.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, JIN WON;YOU, YON HO
分类号 H01L21/50;H01L21/02;H01L21/48 主分类号 H01L21/50
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