| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure body that reduces the load capacity between wiring of a wiring substrate and a semiconductor chip.SOLUTION: A semiconductor device 1a comprises: a wiring substrate 20a; and a chip laminate 30 mounted on the wiring substrate 20a. The wiring substrate 20a has a base material 21, wiring 24 having a predetermined thickness formed on a surface of the base material 21, and a conductive portion 40 formed on the wiring 24. The chip laminate 30 has a plurality of semiconductor chips 10a, 10b, and 10c that are stacked one another, and a bump electrode 17a formed on the first semiconductor chip 10a facing the wiring substrate 20a of the plurality of semiconductor chips 10a, 10b, and 10c. The bump electrode 17a is electrically connected to the conductor portion 40. |
