发明名称 HEAT SINK ASSEMBLY
摘要 A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.
申请公布号 US2014036451(A1) 申请公布日期 2014.02.06
申请号 US201213563393 申请日期 2012.07.31
申请人 SIMON GLENN C.;COWLES DAVID R.;HENSLEY JAMES D.;THEODOSSY CHADI FARID;ROHRER DAVID G.;GREENHOE TERI F. 发明人 SIMON GLENN C.;COWLES DAVID R.;HENSLEY JAMES D.;THEODOSSY CHADI FARID;ROHRER DAVID G.;GREENHOE TERI F.
分类号 H05K7/20;H05K13/00 主分类号 H05K7/20
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