发明名称 |
PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES |
摘要 |
Embodiments of a semiconductor device that includes a semiconductor substrate and a cavity disposed in the semiconductor substrate that extends at least from a first side of the semiconductor substrate to a second side of the semiconductor substrate. The semiconductor device also includes an insulation layer disposed over the first side of the semiconductor substrate and coating sidewalls of the cavity. A conductive layer including a bonding pad is disposed over the insulation layer. The conductive layer extends into the cavity and connects to a metal stack disposed below the second side of the semiconductor substrate. A through silicon via pad is disposed below the second side of the semiconductor substrate and connected to the metal stack. The through silicon via pad is position to accept a through silicon via. |
申请公布号 |
US2014035089(A1) |
申请公布日期 |
2014.02.06 |
申请号 |
US201314052944 |
申请日期 |
2013.10.14 |
申请人 |
OMNIVISION TECHNOLOGIES, INC. |
发明人 |
QIAN YIN;TAI DYSON H.;KU KEH-CHIANG;VENEZIA VINCENT;MAO DULI;ZHENG WEI;RHODES HOWARD E. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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