| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for adhering semiconductors having a low modulus of elasticity and excellent adhesiveness and a semiconductor device using the same.SOLUTION: The provided thermosetting resin composition for adhering semiconductors includes, as indispensable components, (A) an oligomer consisting of a hydrocarbon compound with a number-average molecular weight of 500 or above and 30,000 or below and having, within the molecule skeleton thereof, double bonds or a derivative thereof, (B) a polymerizable monomer having ethylenically unsaturated groups, (C) a radical polymerization catalyst, (D) a liquid telechelic polymer with a number-average molecular weight (Mn) of 5,000 or above and 40,000 or below having a principal chain formed by living radical polymerization, and (E) a filler; a semiconductor device obtained by using the thermosetting resin composition is also provided. |
