| 发明名称 |
Adjusting substrate temperature to improve CD uniformity |
| 摘要 |
A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for. |
| 申请公布号 |
US8642480(B2) |
申请公布日期 |
2014.02.04 |
| 申请号 |
US20100966506 |
申请日期 |
2010.12.13 |
| 申请人 |
GAFF KEITH WILLIAM;SINGH HARMEET;COMENDANT KEITH;VAHEDI VAHID;LAM RESEARCH CORPORATION |
发明人 |
GAFF KEITH WILLIAM;SINGH HARMEET;COMENDANT KEITH;VAHEDI VAHID |
| 分类号 |
H01L21/66;H01L21/3065 |
主分类号 |
H01L21/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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