发明名称 |
Tape residue-free bump area after wafer back grinding |
摘要 |
Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer. |
申请公布号 |
US8642390(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US20100726317 |
申请日期 |
2010.03.17 |
申请人 |
WANG CHUNG YU;WANG JIANN-JONG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHUNG YU;WANG JIANN-JONG |
分类号 |
H01L21/00;H01L21/46 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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