| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: A thermosetting resin composition produced by combining 2,2-bis[4-(4-maleimide phenoxy)phenyl]propane, siloxane diamine and an amine compound having an acidic substituent, and a prepreg, a laminate and a printed wiring board using the same are provided. The thermosetting resin is preferable for a semiconductor package and a print circuit board and excellent in low thermal expansion and desmear resistance. |
