| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus which allows for confirmation of chips on the back side of a wafer in the same apparatus.SOLUTION: A cutting device includes a chuck table for holding a workpiece W, cutting means for cutting the workpiece W held on the chuck table, and a cassette mounting table 30. The cassette mounting table 30 mounts a cassette for housing the workpiece W on the upper surface thereof. A pair of guide rails 32 for supporting a frame F, to which the workpiece W being carried in the cassette mounting table 30 is stuck, and image pick-up means 33 for capturing the image of the workpiece W, stuck to the frame F supported on the pair of guide rails 32, over a dicing tape T from the back side WR are disposed in the cassette mounting table 30. |
