| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, an adhesive film and a dicing tape integrated adhesive film having high connectability, heat resistance and flexibility and, also, to provide a semiconductor device, a multilayer circuit board and an electronic component having excellent reliability using the thermosetting resin composition, the adhesive film and the dicing tape integrated adhesive film.SOLUTION: There is provided a thermosetting resin composition which constitutes a resin composition layer used for a solder joint surface of a first component, comprising an epoxy resin, a phenolic curing agent, and a compound with a flux function having an alkyl carboxyl group and two or more phenolic hydroxy groups positioned within a molecule. |
