发明名称 WIRING FORMATION METHOD AND WIRING FORMATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring formation method using an electrostatic suction type inkjet method, which achieves a high manufacturing speed and excellent production efficiency even when a quantity of products increases.SOLUTION: A wiring formation method comprises: a process of forming an original drawing plate 10 including on a substrate 11, a drawing pattern 12 formed by a drawing material and a non-drawing part 13 composed of a non-drawing material having electric resistivity different from that of the drawing material; and a process of forming a wiring pattern 14 by generating a potential difference between a discharge head 30 for discharging a liquid wiring material and the original drawing plate 10, and making droplets of the wiring material 34 which are made to fly from the discharge head 30 land on the drawing pattern 12.
申请公布号 JP2014017360(A) 申请公布日期 2014.01.30
申请号 JP20120153492 申请日期 2012.07.09
申请人 RICOH CO LTD 发明人 KANEMATSU TOSHIHIRO;YOHIRA TETSUYA;KAMONO SHUMPEI;MIYATA HIROYUKI
分类号 H05K3/10;H05K3/20;H05K3/24 主分类号 H05K3/10
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