| 摘要 |
PURPOSE: An IR(Infrared Ray) dryer and a PSR(Photo Solder Resist) process method of a printed circuit board using the same are provided to increase the productivity of expensive devices more than twice because the exposure degree of the previous process is reduced less than 50%. CONSTITUTION: An IR dryer(10) comprises a substrate conveyor(100), a chamber unit, a drying unit(300), a vertical operating unit, and a substrate transferring unit(500). The substrate conveyor inserts substrates(20) and discharges the dried substrates from the IR dryer. The chamber unit dries the substrates. The drying unit dries the substrate with infrared rays at the front and rear sides of the chamber unit. The vertical operating unit sets the substrates up on the substrate conveyor and lays the erected substrates on the substrate conveyor. The substrate transferring unit transfers the substrates between the chamber unit and the vertical operating unit. [Reference numerals] (20) Substrate; (210) Chamber #1; (220) Chamber #2 |
