发明名称 |
METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD |
摘要 |
A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region. |
申请公布号 |
US2014021164(A1) |
申请公布日期 |
2014.01.23 |
申请号 |
US201314031779 |
申请日期 |
2013.09.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO |
分类号 |
H05K3/06 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|