发明名称 METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.
申请公布号 US2014021164(A1) 申请公布日期 2014.01.23
申请号 US201314031779 申请日期 2013.09.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE YANG JE;YANG DEK GIN;AN DONG GI;SHIN JAE HO
分类号 H05K3/06 主分类号 H05K3/06
代理机构 代理人
主权项
地址