| 摘要 |
A film peeling apparatus for detaching a region of a film unit on a substrate and including: a tape supply unit configured to supply an adhesive tape onto the film unit; a plurality of pins arranged above the adhesive tape, vertically descendible toward the adhesive tape to attach a portion of the film unit to an adhesive surface of the adhesive tape, and sequentially vertically liftable after the portion of the film unit is attached to the adhesive surface of the adhesive tape; and a tape recovery unit configured to recover the adhesive tape having the portion of the film attached thereto, and apply a tension force to the adhesive tape after the portion of the film unit is adhered to the adhesive tape. |
