| 发明名称 |
Systems and Methods of Separating Bonded Wafers |
| 摘要 |
Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers. |
| 申请公布号 |
US2014020818(A1) |
申请公布日期 |
2014.01.23 |
| 申请号 |
US201213554751 |
申请日期 |
2012.07.20 |
| 申请人 |
HUANG XIN-HUA;LIU PING-YIN;LIN HUNG-HUA;HSIEH YUAN-CHIH;CHAO LAN-LIN;TSAI CHIA-SHIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG XIN-HUA;LIU PING-YIN;LIN HUNG-HUA;HSIEH YUAN-CHIH;CHAO LAN-LIN;TSAI CHIA-SHIUNG |
| 分类号 |
B32B38/10;B32B37/02 |
主分类号 |
B32B38/10 |
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