| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure for an electronic apparatus, which facilitates cooling multiple electronic components having different heights.SOLUTION: A heat dissipation structure for an electronic apparatus is configured to mount electronic components 1, 3 to generate heat by energization on a substrate 2 and transmit heat from the multiple electronic components 1, 3 to a thermal diffusion plate 6 arranged to cover the upper surface side of the multiple electronic components 1, 3. The electronic components 1, 3 include the electronic component 1 larger in height when measured from the substrate 2 and the electronic component 3 smaller in height. A working fluid 8 to be evaporated by heating, to dissipate heat, and to be condensed is enclosed inside a sealed container 7a. A heat transmission member 7 where the container 7a is expanded by the evaporation of the working fluid is held at least between the upper surface of the electronic component 3 smaller in height and the lower surface of the thermal diffusion plate 6. |
