发明名称
摘要 <p>The invention provides a consumption managing method of a cutting blade in a cutting device, wherein the cutting blade can continuously perform cutting process all along. The consumption managing method of a cutting blade in a cutting device with a first and a second chuck workbenches comprises: a first cutting process, in which a wafer is held on the first chuck workbench and cut; a second cutting process, in which the wafer is held on the second chuck workbench and cut; a consumption calculating process, in which during the implementation of the second cutting process, the first chuck workbench is positioned just below a deepness detecting component, and the deepness of a cutting groove formed on the wafer is detected by the deepness detecting component, and the consumption of the cutting blade is calculated based on the detected groove deepness; and a position correcting process, in which the origin position of the cutting blade in the height direction is corrected based on the consumption of the cutting blade.</p>
申请公布号 JP5394204(B2) 申请公布日期 2014.01.22
申请号 JP20090259216 申请日期 2009.11.12
申请人 发明人
分类号 B24B49/03;B24B27/06;B24B41/04;B24B41/06;H01L21/301 主分类号 B24B49/03
代理机构 代理人
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