发明名称 POLISHING COMPOSITION
摘要 A polishing composition contains colloidal silica. The colloidal silica satisfies the expression A × D × E × F ‰¥ 350,000 where "A" denotes the average aspect ratio (dimensionless) of the colloidal silica, "D" denotes the average particle diameter (units: nm) of the colloidal silica, "E" denotes the standard deviation of the particle size (units: nm) of the colloidal silica, and "F" denotes the volume fraction (units: %) of particles having a diameter of 1 to 300 nm in the colloidal silica. The volume fraction of particles having a diameter of 1 to 300 nm in the colloidal silica is 90% or greater.
申请公布号 EP2613344(A4) 申请公布日期 2014.01.22
申请号 EP20110821644 申请日期 2011.08.25
申请人 FUJIMI INCORPORATED 发明人 ASHITAKA, KEIJI;MORINAGA, HITOSHI;TAHARA, MUNEAKI
分类号 H01L21/304;B24B37/00;C09G1/02;C09K3/14;H01L21/02;H01L21/3105 主分类号 H01L21/304
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