发明名称 |
Thermally conductive silicone composition and electronic device |
摘要 |
A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions. |
申请公布号 |
US8633276(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20090994475 |
申请日期 |
2009.05.12 |
申请人 |
DOMAE NARUMASA;KATO TOMOKO;NAKAYOSHI KAZUMI;DOW CORNING TORAY COMPANY, LTD. |
发明人 |
DOMAE NARUMASA;KATO TOMOKO;NAKAYOSHI KAZUMI |
分类号 |
C08L83/06 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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