发明名称 METHOD AND APPARATUS FOR MOLDING RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a method for molding a resin molding and the like capable of assembling a molding resin on a fixed member easily without requiring a troublesome labor of an operator.SOLUTION: By using a molding apparatus including: a mold part 4 having a resin sheet 11 placed thereon, and having a mold surface 41 with a desired shape; a clamp fixing hole 43 provided on the mold part 4, for storing a clamp 12 in the positioned state with a sheet fixing part 13 as an upper side; and suction holes 42 opened on the molding surface 41 and on the clamp fixing hole 43, for sucking the air, the clamp 12 is stored in the clamp fixing hole 43 with the sheet fixing part 13 as the upper side; the heated resin sheet 11 is arranged on the molding surface 41; air is sucked from the suction hole 42 to thereby suck the resin sheet 11 to be molded in a desired shape; and further a resin fixing part 15 by wraparound of the resin sheet 11 is molded on the lower surface side of the sheet fixing part 13.
申请公布号 JP2014008732(A) 申请公布日期 2014.01.20
申请号 JP20120148349 申请日期 2012.07.02
申请人 YAZAKI CORP 发明人 ITO MASAHIRO;SHIMOJI EIJI;NAKAMURA GORO
分类号 B29C51/12;B29C51/10;B29C51/30;B29C51/36;B60R16/02 主分类号 B29C51/12
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