发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF USE THEREOF |
摘要 |
A one-component epoxy containing photosensitive composition and a method of using that composition is disclosed . The composition is aqueous developable and suitable for use as a solder, etch or plate resist in the manufacture of printed circuit boards. The composition also shows good storage stability properties and can be processed under standard exposure and development processes. The photosensitive composition primarily contains (a) at least one compound having one or more carboxyl groups, (b) at least one compound having two or more ethylenically unsaturated functionalities and (c) at least one compound having two or more epoxyl groups.
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申请公布号 |
CA2032329(A1) |
申请公布日期 |
1991.06.16 |
申请号 |
CA19902032329 |
申请日期 |
1990.12.14 |
申请人 |
NISHIKAWA, KATSUE;TSAI, HSI-CHUAN |
发明人 |
NISHIKAWA, KATSUE;TSAI, HSI-CHUAN |
分类号 |
G03F7/027;G03F7/028;G03F7/033;H05K3/28;(IPC1-7):G03F7/038 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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