发明名称 |
Wafer Alignment System and Method |
摘要 |
A system and method for mitigating annealing fingerprints in semiconductor wafers is provided. An embodiment comprises aligning the semiconductor wafers prior to each annealing step. This alignment generates similar or identical fingerprints in each of the semiconductor wafers manufactured. With the fingerprint known, a single compensation model for a subsequent photoresist may be utilized to compensate for the fingerprint in each of the semiconductor wafers. |
申请公布号 |
US2014011348(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213544467 |
申请日期 |
2012.07.09 |
申请人 |
SYUE SEN-HONG;HO CHUNG-CHUN;CHEN PU-FANG;WANG SHIANG-BAU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SYUE SEN-HONG;HO CHUNG-CHUN;CHEN PU-FANG;WANG SHIANG-BAU |
分类号 |
H01L21/306;H01L21/26 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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