Method for manufacturing an extendable circuit support and extendable circuit support

摘要

The method involves applying a base material for an extendable substrate on an electrically conductive foil, which forms an extendable substrate layer connected with the foil. The foil is structured such that the foil forms a conductor structure with an extendable conductive path (7). The foil exhibits the thickness of 5 to 100 micrometers that is formed of copper or silver or gold. The foil is roughened or oxidized before applying the material to a surface turned away to the layer. Another extendable layer (14) over-covering the structure is applied according to structuring of the foil. An independent claim is also included for an extendable circuit carrier with an extendable substrate.