| 摘要 |
PROBLEM TO BE SOLVED: To do so that a wafer can be surely supported without substantially contacting the wafer back face by providing specified slope on a mount to support the semiconductor wafer in substantially a line contact, without contacting the wafer back face. SOLUTION: Mounting parts 12a, 12b for supporting a wafer are formed near the front ends and roots of fork foots 13, it has front and rear mounting parts 12a, 12b, each like a circular arc and disposed to face the periphery of an Si wafer 1. Esp. the mounting parts 12a, 12b are sloped so that the inside of the fork is recessed and its slope angle B ranges between 3 and 45 deg.. By setting the slope angle B of the mounting parts 12a, 12b in this range, the wafer 1 can be supported in a substantially line contact, without contacting the wafer back face. From such view point the slope angle B more pref. ranges between 5 and 20 deg.. |
