发明名称 ELECTRONIC COMPONENT METAL MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING SAID ELECTRONIC COMPONENT METAL MATERIAL
摘要 An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic component using said electronic component metal material are provided. This electronic component metal material is provided with: a substrate; a lower layer formed on the substrate and configured from one or more elements selected from constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu; a middle layer formed on the lower layer and configured from an alloy of one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and one or two elements selected from constituent element group C consisting of Sn and In; and an upper layer formed on the middle layer and configured from one or two elements selected from constituent element group C consisting of Sn and In. The thickness of the lower layer is greater than or equal to 0.05mum and less than 5.00mum, the thickness of the middle layer is greater than or equal to 0.02mum and less than 0.80mum, and the thickness of the upper layer is greater than or equal to 0.005mum and less than 0.30mum.
申请公布号 WO2014003147(A1) 申请公布日期 2014.01.03
申请号 WO2013JP67730 申请日期 2013.06.27
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 SHIBUYA,YOSHITAKA;FUKAMACHI,KAZUHIKO;KODAMA,ATSUSHI
分类号 C23C30/00;C22C5/06;C25D5/10;C25D7/00;H01B1/02;H01B5/02;H01R13/03;H01R13/04 主分类号 C23C30/00
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