发明名称 Method of fabricating semiconductor device having notched gate
摘要 A semiconductor device includes: a silicon substrate; a source/drain region formed in the substrate including a lightly doped region and an adjacent heavily doped region, the depth of the heavily doped region being greater than the depth of the lightly doped region; a gate oxide layer on the silicon substrate; and a notched gate electrode on the substrate, the notched gate electrode including a notch along an outer side surface of a lower portion such that a top portion of the notched gate electrode is wider than the lower portion, the gate oxide layer extending between the interface of the notched gate electrode and the substrate, and a gate poly oxide layer provided along an outer side surface of the notched gate electrode and along an inner wall of the notch, a portion of the lightly doped region being under the notch.
申请公布号 US6858907(B2) 申请公布日期 2005.02.22
申请号 US20020114214 申请日期 2002.04.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU HYUK-JU;KO YOUNG-GUN
分类号 H01L21/338;H01L21/28;H01L21/336;H01L29/49;H01L29/78;(IPC1-7):H01L21/02 主分类号 H01L21/338
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