| 摘要 |
<p>A device comprising a substrate (12), an integrated circuit (IC) die (18) attached to the substrate on one side, a plurality of contact pads (40, 42, 44) on an active side (19) of the IC die, a plurality of thermally and electrically conductive legs (28-32), each of the legs attached to a respective one of the contact pads (40, 42, 44), and an encapsulating material (46) formed around the substrate, the IC die, and a portion of the legs. A contact end (58, 60, 62) of each of the legs is exposed, and one of the contact ends conducts a signal from a transistor (90) in the IC die.</p> |
