发明名称 Mounting board including a flat-type electrical element and capable of being reduced in size, and lead-attached electric element that is flat in shape and has a lead bonded to each electrode face
摘要 A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.
申请公布号 US8618423(B2) 申请公布日期 2013.12.31
申请号 US20080056854 申请日期 2008.03.27
申请人 OZAKI HIROTOSHI;MORIMOTO AKIKO;YAMASHITA TETSUYA;SANYO ELECTRIC CO., LTD.;SANYO ENERGY TOTTORI CO., LTD 发明人 OZAKI HIROTOSHI;MORIMOTO AKIKO;YAMASHITA TETSUYA
分类号 H01R12/51;H05K1/00 主分类号 H01R12/51
代理机构 代理人
主权项
地址