| 发明名称 |
RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME |
| 摘要 |
<p>An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio - and electromagnetic interference.</p> |
| 申请公布号 |
SG194739(A1) |
申请公布日期 |
2013.12.30 |
| 申请号 |
SG20130081047 |
申请日期 |
2012.04.27 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KAMGAING, TELESPHOR;RAO, VALLURI R. |
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