发明名称 |
MANUFACTURING METHOD OF RESIN MOLDING MOLD, RESIN MOLDING MOLD, RESIN MOLDING MOLD SET, MANUFACTURING METHOD OF MICROCHIP SUBSTRATE, AND MANUFACTURING METHOD OF MICROCHIP USING SAID MOLD |
摘要 |
A method for producing a resin molding die (13) for molding a first substrate (2) having a flow path (2b) and a through-hole (2a), wherein a base die (10) having a concave part (10b) corresponding to the flow path (2b) and a through-hole (10a) corresponding to through-hole (2a) and deeper than the concave part (10b) is prepared, the base die (10) is subjected to electroforming with a first material and is then subjected to electroforming with a second material which is different from the first material, and a protruding part for forming through-hole (10a) by removing the first material that was electrodeposited on through-hole (10a) is formed. The first material has a smaller electroforming stress than the second material, the first material exerts a higher adhesiveness with regard to the base die than the second material, and the second material is harder than the first material. |
申请公布号 |
US2013341834(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201214004043 |
申请日期 |
2012.02.24 |
申请人 |
GOSHIMA TAKEHIKO;KONICA MINOLTA, INC. |
发明人 |
GOSHIMA TAKEHIKO |
分类号 |
B29C45/14;C25D1/10 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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