发明名称 MULTILAYER FILM FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART BAG
摘要 <p>Disclosed is a multilayer film for packaging electronic parts and an electronic part bag. The multilayer film for packaging electronic parts and bag for electronic parts according to the present invention comprise a three-layer base film having an outer layer, center layer and inner layer, and the three layers have a width of 50~250μm and are composed of polyolefine films. The present invention has an excellent moisture barrier property, gas permeability, strength property, shrinkage property and heat-adhesive property. In addition, the present invention is appropriate for packaging electronic parts, is environment-friendly, has high recyclability and contains a surface with an antistatic agent. The polyolefine film and packaging bag disclosed by the present invention effectively protect objects inside while transporting or packaging electronic elements, display panel, complete product, semiconductor chip, PCB, cartridge for secondary batteries, and solar batteries since static electricity and corona discharge during arc discharge are prevented.</p>
申请公布号 KR20130139159(A) 申请公布日期 2013.12.20
申请号 KR20130037451 申请日期 2013.04.05
申请人 TNF CORPORATION 发明人 KIM, KYUNG HOON;KANG, YONG GU;LEE, WHAL JONG;KANG, HO JONG;LEE, KYUNG MI;JOE, BYEONG SEON
分类号 B32B27/32;B32B27/18;B65D65/40 主分类号 B32B27/32
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