| 发明名称 |
MEASURING DEVICE AND METHOD FOR MEASURING LAYER THICKNESSES AND DEFECTS IN A WAFER STCAK |
| 摘要 |
The invention relates to a measurement means and a method for measuring and/or acquiring layer thicknesses and/or voids of one or more layers of a wafer stack on a plurality of measuring points distributed on the wafer stack and a corresponding wafer processing device. |
| 申请公布号 |
KR20130139251(A) |
申请公布日期 |
2013.12.20 |
| 申请号 |
KR20137008189 |
申请日期 |
2010.11.12 |
| 申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
WIMPLINGER MARKUS |
| 分类号 |
G01N29/04;G01B7/06;G01N21/95;G01N29/265;G01N29/27;H01L21/66 |
主分类号 |
G01N29/04 |
| 代理机构 |
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代理人 |
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