发明名称 COMPOSITION FOR FORMING INSULATION LAYER, FILM FOR FORMING INSULATION LAYER AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an insulation layer forming composition and an insulation layer forming film capable of forming an insulation layer having excellent heat-conductivity and insulation properties, and to provide a substrate having excellent heat-dissipation properties and reliability.SOLUTION: There are provided an insulation layer forming composition for forming an insulation layer and constituted of a resin material, a filler composed of an inorganic material and a silane coupling agent having a secondary amino group; an insulation layer forming film having an insulation layer forming layer obtained by forming the insulation layer forming composition in the form of a layer; and a substrate having a metallic plate made of a metallic material, an insulation layer formed on the metallic layer and comprising a cured material or solidified material obtained by forming the insulation layer forming composition in the form of a layer, and a conductive layer formed on a face of the insulation layer opposite to the face having the metallic plate.
申请公布号 JP2013253126(A) 申请公布日期 2013.12.19
申请号 JP20120127709 申请日期 2012.06.05
申请人 SUMITOMO BAKELITE CO LTD 发明人 TOBISAWA AKIHIKO;SHIRATO HIROTSUGU
分类号 C08L101/00;B32B15/08;C08K3/22;C08K3/28;C08K5/54;H01B3/00;H01B3/30;H01B5/14;H01B17/62 主分类号 C08L101/00
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