发明名称 |
COMPOSITION FOR FORMING INSULATION LAYER, FILM FOR FORMING INSULATION LAYER AND SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an insulation layer forming composition and an insulation layer forming film capable of forming an insulation layer having excellent heat-conductivity and insulation properties, and to provide a substrate having excellent heat-dissipation properties and reliability.SOLUTION: There are provided an insulation layer forming composition for forming an insulation layer and constituted of a resin material, a filler composed of an inorganic material and a silane coupling agent having a secondary amino group; an insulation layer forming film having an insulation layer forming layer obtained by forming the insulation layer forming composition in the form of a layer; and a substrate having a metallic plate made of a metallic material, an insulation layer formed on the metallic layer and comprising a cured material or solidified material obtained by forming the insulation layer forming composition in the form of a layer, and a conductive layer formed on a face of the insulation layer opposite to the face having the metallic plate. |
申请公布号 |
JP2013253126(A) |
申请公布日期 |
2013.12.19 |
申请号 |
JP20120127709 |
申请日期 |
2012.06.05 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
TOBISAWA AKIHIKO;SHIRATO HIROTSUGU |
分类号 |
C08L101/00;B32B15/08;C08K3/22;C08K3/28;C08K5/54;H01B3/00;H01B3/30;H01B5/14;H01B17/62 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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