发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
摘要 |
There is provided a semiconductor device and a method for fabricating the same. The semiconductor device comprises: a semiconductor substrate; gates, spacers on both sides of the respective gates, and source/drain regions on both sides of the respective spacers, which are formed on the semiconductor substrate; lower contacts located on the respective source/drain regions and abutting outer-sidewalls of the spacers, with bottoms covering at least a portion of the respective source/drain regions; an inter-layer dielectric layer formed on the gates, the spacers, the source/drain regions, and the lower contacts, wherein the respective source/drain regions of each of the transistor structures are isolated from each other by the inter-layer dielectric layer; and upper contacts formed in the inter-layer dielectric layer and corresponding to the lower contacts. Embodiments of the present invention apply to the fabrication of contacts for semiconductor devices. |
申请公布号 |
EP2562794(A4) |
申请公布日期 |
2013.12.18 |
申请号 |
EP20100850023 |
申请日期 |
2010.09.17 |
申请人 |
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES |
发明人 |
YIN, HAIZHOU;LUO, ZHIJIONG;ZHU, HUILONG |
分类号 |
H01L21/768;H01L21/28;H01L21/8234;H01L29/41 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|