发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 There is provided a semiconductor device and a method for fabricating the same. The semiconductor device comprises: a semiconductor substrate; gates, spacers on both sides of the respective gates, and source/drain regions on both sides of the respective spacers, which are formed on the semiconductor substrate; lower contacts located on the respective source/drain regions and abutting outer-sidewalls of the spacers, with bottoms covering at least a portion of the respective source/drain regions; an inter-layer dielectric layer formed on the gates, the spacers, the source/drain regions, and the lower contacts, wherein the respective source/drain regions of each of the transistor structures are isolated from each other by the inter-layer dielectric layer; and upper contacts formed in the inter-layer dielectric layer and corresponding to the lower contacts. Embodiments of the present invention apply to the fabrication of contacts for semiconductor devices.
申请公布号 EP2562794(A4) 申请公布日期 2013.12.18
申请号 EP20100850023 申请日期 2010.09.17
申请人 INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES 发明人 YIN, HAIZHOU;LUO, ZHIJIONG;ZHU, HUILONG
分类号 H01L21/768;H01L21/28;H01L21/8234;H01L29/41 主分类号 H01L21/768
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