发明名称
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming an electrical insulating film that can give a cured film excellent in resolution, electrical insulation, cohesiveness, adhesion, etc. SOLUTION: The photosensitive resin composition for forming an insulating film comprises (A) a resin containing a structural unit having a phenolic hydroxyl group, (B) at least one kind of the compounds selected from the compounds represented by formula (b1) and (b2), (C) a photosensitive acid generator, and (D) a solvent, wherein, (b1) is (R)<SB>n</SB>Si(OR<SP>1</SP>)<SB>4-n</SB>and (b2) is (R<SP>2</SP>)[R<SP>3</SP>Si(OR<SP>1</SP>)<SB>3</SB>]<SB>m</SB>, and R represents a hydrogen atom or a hydrocarbon group that may have a substituent group such as an epoxy and oxetanyl, R<SP>1</SP>represents a 1-5C alkyl group, n is an integer of 0-2, R<SP>2</SP>represents a m-valent group selected from an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group, R<SP>3</SP>represents a methylene group or a 2-5C alkylene group, and m is an integer of 1-10. COPYRIGHT: (C)2009,JPO&amp;INPIT
申请公布号 JP5369420(B2) 申请公布日期 2013.12.18
申请号 JP20070275306 申请日期 2007.10.23
申请人 发明人
分类号 C08L61/06;C08K5/5415;C08L25/04;C09D5/25;C09D7/12;C09D125/04;C09D161/06;H01L21/312 主分类号 C08L61/06
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