A LIGHT EMITTING DEVICE PACKAGE

摘要

An embodiment of the present invention includes a package body having a cavity; first to fourth lead frames, a first semiconductor layer, an active layer, and a second semiconductor layer, which are arranged within the package body; and first and second light emitting chips emitting lights of different wavelengths. Each of the first to fourth lead frames comprises an upper surface portion exposed to the cavity and a side part bent from one side of the upper surface portion and exposed to one side of the package body. The first light emitting chip is arranged on the upper surface portion of the first lead frame, and the second light emitting chip is arranged on the upper surface portion of the third lead frame.