| 摘要 |
The purpose of the present invention is to provide a method for processing a wafer which can clearly divides a wafer, which has a device formed by a functional layer laminated on the surface of a substrate, along streets without lowering the flexure strength of the device. The method for processing a wafer according to the present invention is provided to divide a wafer, which has a device formed by a functional layer laminated on the surface of a substrate, along multiple streets partitioning off the device, and comprises: a process for forming a rule groove, which does not reach a substrate along the street, on a functional layer by irradiating the street with a laser beam which has frequencies absorbing the functional layer; a reforming layer forming process for forming a reforming layer along the street inside the substrate irradiating the area from the other side of the wafer along the street with a laser beam having frequencies capable of transmitting the wafer substrate; and a dividing process for dividing the wafer along the street by applying external power to the wafer provided with the reforming layer. |
