| 发明名称 |
Semiconductor device and semiconductor assembly with lead-free solder |
| 摘要 |
A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent. |
| 申请公布号 |
US8610270(B2) |
申请公布日期 |
2013.12.17 |
| 申请号 |
US20100702636 |
申请日期 |
2010.02.09 |
| 申请人 |
LAI YI-JEN;HAN CHIH-KANG;CHAN CHIEN-PIN;CHIEN CHIH-YUAN;YANG HUAI-TEI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LAI YI-JEN;HAN CHIH-KANG;CHAN CHIEN-PIN;CHIEN CHIH-YUAN;YANG HUAI-TEI |
| 分类号 |
H01L23/498;H01L23/48 |
主分类号 |
H01L23/498 |
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