发明名称 |
STRUTTURA COMPRENSIVA DI INVOLUCRO COMPRENDENTE CONNESSIONI LATERALI |
摘要 |
A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. |
申请公布号 |
ITVI20120145(A1) |
申请公布日期 |
2013.12.16 |
申请号 |
IT2012VI00145 |
申请日期 |
2012.06.15 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
PAGANI ALBERTO;ZIGLIOLI FEDERICO GIOVANNI |
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