| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure detection device capable of reducing manufacturing costs by simplifying a structure.SOLUTION: A pressure detection device includes a fluid flow-in member 10, a semiconductor pressure sensor 20 (sensor), a first unit member 30 having a first lead terminal 33 connected to the sensor 20, a lid member 40 covering the sensor 20 to form a sealed space, a second unit member 50 having a second lead terminal 51 connected to the first lead terminal 33, a resin cover member 60 connecting the members 10, 20, 30, 40, and 50, and exposing a part of the second lead terminal 51 while covering the members 30, 40, and 50 by resin molding. The sensor 20 and the first lead terminal 33 are connected by wire bonding, the first lead terminal 33 and the second lead terminal 51 are coupled together by welding, and the coupled part is covered during formation of the resin cover member 60. |
