发明名称 ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide an element module capable of controlling the mounting attitude of an element.SOLUTION: According to one embodiment, an element module includes: a mounting substrate having a mounting surface and multiple pads provided on the mounting surface; an element having multiple electrode surfaces aligned in a first direction and mounted on the mounting substrate with the electrode surfaces facing the mounting surface; and a conductive joining material provided between the pads and the electrode surfaces. Each pad includes: a first width part that forms a width viewed in a second direction perpendicular to the first direction; and a second width part where the width viewed in the second direction is larger than the first width part and the electrode surface. One end part on the electrode surface, which is viewed in the first direction, is joined to the pad through the joining material on the first width part, and the other end part on the electrode surface, which is viewed in the first direction, is joined to the pad through the joining material on the second width part.
申请公布号 JP2013251493(A) 申请公布日期 2013.12.12
申请号 JP20120127102 申请日期 2012.06.04
申请人 TOSHIBA CORP 发明人 SUGIZAKI YOSHIAKI;FURUYAMA HIDETO;KOJIMA AKIHIRO;SHIMADA MIYOKO;AKIMOTO YOSUKE;TOMIZAWA HIDEYUKI
分类号 H01L33/62;H01L23/12;H01L33/32;H05K3/34 主分类号 H01L33/62
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