发明名称 Butted SOI junction isolation structures and devices and method of fabrication
摘要 <p>A structure, a FET, a method of making the structure and of making the FET. The structure including: a silicon layer on a buried oxide (BOX) layer of a silicon-on-insulator substrate; a trench in the silicon layer extending from a top surface of the silicon layer into the silicon layer, the trench not extending to the BOX layer, a doped region in the silicon layer between and abutting the BOX layer and a bottom of the trench, the first doped region doped to a first dopant concentration; a first epitaxial layer, doped to a second dopant concentration, in a bottom of the trench; a second epitaxial layer, doped to a third dopant concentration, on the first epitaxial layer in the trench; and wherein the third dopant concentration is greater than the first and second dopant concentrations and the first dopant concentration is greater than the second dopant concentration.</p>
申请公布号 GB2497259(B) 申请公布日期 2013.12.11
申请号 GB20130006404 申请日期 2011.11.10
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JEFFREY B JOHNSON;SHREESH NARASIMHA;HASAN M NAYFEH;VIOREL C ONTALUS;ROBERT R ROBINSON
分类号 H01L21/762;H01L21/84;H01L27/12 主分类号 H01L21/762
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