发明名称 |
Multi-chip electronic package with reduced stress |
摘要 |
An electronic component includes lead fingers and a die paddle. A tape pad is mounted below the lead fingers and the die paddle. A first semiconductor chip is bonded onto the tape pad by a layer of first adhesive and a second semiconductor chip is bonded onto the die paddle by a layer of second adhesive. Electrical contacts are disposed between the contact areas of the semiconductors chips and the lead fingers. An encapsulating compound covers part of the lead fingers, the tape pad, the semiconductor chips and the electrical contacts. |
申请公布号 |
US8604595(B2) |
申请公布日期 |
2013.12.10 |
申请号 |
US20080191555 |
申请日期 |
2008.08.14 |
申请人 |
LIM CHEE CHIAN;HNG MAY TING;INFINEON TECHNOLOGIES AG |
发明人 |
LIM CHEE CHIAN;HNG MAY TING |
分类号 |
H01L23/495;H01L23/538 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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