HEAT PROCESSING APPARATUS, COOLING METHOD FOR HEAT PROCESSING PLATE, AND COMPUTER STORAGE MEDIUM

摘要

The present invention rapidly increases and decreases the temperature of a heat processing plate. The present invention relates to a heat processing device capable of performing heat processing by laminating a wafer (W) on the heat processing plate (50). The heat processing device comprises a second cooling plate (62), a first cooling plate (61), and a cooling plate elevating tool (60). The second cooling plate approaches and cools the heat processing plate (50). The first cooling plate cools the second cooling plate. The cooling plate elevating tool moves the second cooling plate (62) between a waiting position for cooling the first cooling plate (61) and a cooling position for cooling the heat processing plate (50). An elastic member (95) is installed between the second cooling plate (62) and the cooling plate elevating tool (60).