发明名称 Thin film semiconductor device, display device using such thin film semiconductor device and manufacturing method thereof
摘要 A thin film semiconductor device formed as integrated circuits on an insulating substrate with bottom gate type thin film transistors stacked with gate electrodes, a gate insulating film and a semiconductor thin film in the order from below upward. The gate electrodes comprise metallic materials with thickness less than 100 nm. The gate insulating film has a thickness thicker than the gate electrodes. The semiconductor thin film comprises polycrystalline silicon crystallized by a laser beam. By reducing thickness of metallic gate electrodes, thermal capacity becomes small and difference in thermal condition on the metallic gate electrodes and on the insulating substrate made of glass or the like becomes small. This invention relates to the task of uniforming and optimizing recrystallization by a laser anneal treatment provided for the semiconductor thin film which works as an active layer of the bottom gate type thin film transistors.
申请公布号 US8604483(B2) 申请公布日期 2013.12.10
申请号 US20100801791 申请日期 2010.06.25
申请人 HAYASHI HISAO;FUJINO MASAHIRO;SHIMOGAICHI YASUSHI;TAKATOKU MAKOTO;SONY CORPORATION 发明人 HAYASHI HISAO;FUJINO MASAHIRO;SHIMOGAICHI YASUSHI;TAKATOKU MAKOTO
分类号 G09F9/30;H01L29/04;G02F1/136;G02F1/1362;G02F1/1368;H01L21/20;H01L21/336;H01L27/12;H01L29/423;H01L29/786;H01L31/036 主分类号 G09F9/30
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